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EOS TELCOMS NEWS
January 7, 2017
Rumours that Apple is considering using Broadcom chips in its next generation iPhone are circulating through cyberspace.
According to a DigiTimes report, Taiwan-based equipment makers have seen Broadcom’s baseband and RF chips on circuit boards believed to be samples for the next iPhone model.
If the rumours prove true, Apple’s current chip supplier, Infineon, could lose its contract for the iPhone.
With Samsung as its only other major customer, losing the iPhone contract could force Infineon out of the handset market.
Broadcom continues to develop handset chips, despite not receiving any significant handset orders for over 12 months.
Both Broadcom and Infineon refused to comment on the speculation.